High quality soldering of Surface Mount technologies requires correct setup of the thermal profiles.  Both solder paste parameters and component peak temperatures need to be verified to be within specification.

The SolderStar reflow systems provide the most comprehensive platform for setup, optimisation and ongoing verification of reflow profiles.

Whether you need periodic profiling or continuous profiling, Solderstar have the equipment, experience and technical support network to provide the best thermal profiling solution for your reflow soldering process.  Follow the links to read more about our products and how they can improve the reliability and quality of your PCB manufacturing.

Manufactured from 10 mm anti-static composite and fitted with durable titanium side rails, the systems are designed to survive the rigours of daily production use. These unique  measurements fixtures incorporates titanium contact sensors on the underside which captures wave parameter data as it moves through the solder wave, including a true measurement of wave heights.

All key process parameters are captured with a single run through the machine, data is then downloaded via USB or wireless interface for analysis on the engineer’s computer. All parameters can be then be quickly analysed by using the unique Solderstar Process Checker function showing the good/bad limits to allow periodic process verification to be performed without the need for specialist knowledge.

Vapour phase soldering is not a new process, and with advanced machines available it is common place where throughput is not the main concern. Like all production processes, without proper control, problems will occur such as tombstoning or component positioning problems due to overly aggressive vacuum settings. The Solderstar system is specifically developed to pass through the VP process with the electronic assembly to allow the engineer to measure and understand this process fully.

The Solderstar VP systems uses a specially developed two-piece protective shield, fully machined from aluminium this enclosure is both ‘O’ ring sealed and Teflon coated to maximise the protection of the measuring instrument while passing through this harsh environment process.

Many software packages are difficult to understand and use, and their output requires a degree of interpretation that assumes long experience in profiling.

That's why SolderStar's Profile Central thermal profiling software stands apart. Unique in its simplicity, yet powerful in functionality, it sets the standard for the electronics manufacturing industry, enabling users to understand, analyse and optimise their thermal processes quickly and easily.

Profile Central software enables users of all levels to measure and improve their soldering processes, from high complexity assembly set-up and optimisation to fully integrated SPC capabilities for continuous quality and process control.