Jetting (Solder & Epoxy)
Jetting (Solder & Epoxy)
Essemtec- Dispensing
Equipped with the most modern and precise what drive and control technology has to offer today. Hardly any other medium behaves in the same way. Environmental conditions are decisive for behavior. For this reason, there are almost no standards when it comes to dosing - depending on the environmental influences and the type of liquid, there are specially tailored solutions - for every type of dosing. The simple programming and operability enables it to be used for a wide variety of dosing applications.
Flexible Modular SMT Assembly Solutions, Aimed At High Mix Low Volume Production
01
Dosing Technology
Either 2 or 3 valves simultaneously across a range of 5 valves for a broad variety of applications
02
Productivity
Up to 150,000 points an hour with piezo jet valve (solder paste)
03
Height Measurement
Measurement of precision utilising laser technology and measurement based compensation
04
Linear Motors
Fast, double-guided linear motors. No maintenance, long service life
Dynamic shockwave
Solder paste, SMD glue
High Viscosity
Up to 260’000 dots/h
Piezo jet
SMD glue, underfill,
conductive silver glue, UV glue,
globe top, encapsulation,
solder paste
Low-High Viscosity
Up to 150’000 dots/h
Screws
Solder paste, SMD glue,
globe top, encapsulation,
conductive silver glue , dam and fill
High Viscosity
Up to 24’000 dots/h
Time Pressure
Gasketing, globe top,
encapsulation, solder paste,
SMD glue, conductive silver glue,
dam and fill
High Viscosity
Up to 28’000 dots/h
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